All kinds of mechanical and electrical products, including electronic chips, micro and nano sensors, high-speed train, aircraft, will inevitably dissipate energy due to various types of friction during normal operation, resulting in high local temperature that affects the reliability and life of the mechanical equipment. The design and manufacture of high-performance mechanical and electrical products need to consider the tribological and thermal problems in the design process. Tribology is mainly concerned with the friction, wear and lubrication of mechanical surface. Heat transfer is mainly concerned with heat conduction, convection and heat radiation. Tribology and Thermal Design Laboratory has advanced testing and processing equipment such as atomic force microscope (AFM), surface force apparatus (SFA), Raman spectroscopy, femtosecond laser, focused ion beam, etc. It mainly carries out simulation, experimental testing, mechanism exploration and active control of tribological and thermal properties of advanced materials and structures ranging from atomic scale to macro scale. The purpose of the Laboratory is to improve the performance of existing mechanical/electrical products and develop new high-performance products with the basic principles of tribology and heat transfer. Main research direction of the Laboratory includes high precision measurement of mechanical, thermal and electrical parameters of micro and nano structures, sliding friction and control, rolling friction and control, thermal design and thermal management of electronic equipment.
Team Members：
Prof. Yunfei Chen, Prof. Juekuan Yang, Prof. Kedong Bi, Prof. Zhen Chen, Assoc. Prof. Yan Zhang, Assoc. Prof. Zhiyong Wei, Assoc. Prof. Yajing Kan, Assoc. Prof. Li Xiang.
